PC Computer Intel Xeon Processor L5630 (12M Cache, 2.13
Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and even may cause some parts to burn. The heat that causes the high temperature does not come from outside the computer, but from inside the computer, or the integrated circuit. The function of the radiator is to absorb this heat, and then diverge to the chassis or chassis, to keep the temperature of the computer components normal. Most radiators absorb heat by contacting the surface of the hot parts, and then transfer the heat to the distance through various methods, such as the air in the case, and then the case transfers the hot air to the outside of the case to complete the heat dissipation of the computer. There are many kinds of radiators, such as CPU, graphics card, motherboard chipset, hard disk, chassis, power supply and even optical drive and memory. These different radiators can not be mixed, and the most common contact is the CPU radiator. Heat sink material refers to the heat sink used by the specific material. Each material has a different thermal conductivity, and is listed in descending order, silver, copper, aluminum, and steel. However, if silver is used as the heat sink, it will be too expensive, so the best solution is to use copper. Although aluminum is much cheaper, it does not conduct heat as well as copper (about percent more than copper). The commonly used heat sink material is copper and aluminum alloy, both have their own advantages and disadvantages. The thermal conductivity of copper is good, but the price is more expensive, the processing difficulty is higher, the weight is too large (many pure copper radiators exceeded the limit of the CPU to the weight), the heat capacity is small, and easy to oxidize. And pure aluminum is too soft, can not be used directly, are the use of aluminum alloy to provide enough hardness, the advantage of aluminum alloy is low price, light weight, but the thermal conductivity is much worse than copper. Some radiators take the head of each, in the aluminum alloy radiator base embedded in a copper plate. For ordinary users, the use of aluminum heat sink has been enough to achieve the heat dissipation requirements. Heat dissipation means to point to the main way that this radiator sends out heat. In thermodynamics, heat dissipation is heat transfer, and there are three main ways of heat transfer: heat conduction, heat convection and heat radiation. The transfer of energy by itself or when matter comes into contact with matter is called heat conduction, and it is the most common form of heat transfer. For example, the CPU heat sink base and CPU direct contact to take away heat is heat conduction. Heat convection refers to the way that the flowing fluid (gas or liquid) will transfer heat to the tropics. In the heat dissipation system of the computer case, it is more common that the heat dissipation fan drives the gas flow, "forced heat convection" heat dissipation. Thermal radiation refers to the transfer of heat by ray radiation, the most common of which is solar radiation. These three ways of heat dissipation are not isolated. In the daily heat transfer, these three ways of heat dissipation all occur at the same time and work together.Key FeaturesBrandName：Intel
IntelModel：Xeonl5630
CPUFrequency：2.1GHz
Application：Server
SocketType：LGA1366
ItemCondition：Used
Type：Quad-Core
LaunchDate：2010
Power：40W
MainFrequency：2.13
L3CacheCapacity：12MB
ProcessorType：IntelXeon
ChipProcess：32nanometers
InterfaceType：LGA1366
NumberofCores：Quad-Core
Package：No
L2CacheCapacity：1MB
64-BitSupport：No
ModelNumber：XeonL5630Barcode: NoCertification: CEWhat's In the Box1*product
